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    [会议]   Min Jian Yang   Yueling Zeng   Li-C. Wang        IEEE International Test Conference        2022年      共 10 页
    摘要 : In the context of analyzing wafer maps, we present a novel approach to enable analytics to be driven by user queries. The analytic context includes two aspects: (1) grouping wafer maps based on their failure patterns and (2) for a... 展开

    [会议]   Yueling Jenny Zeng   Li-C. Wang   Chuanhe Jay Shan   Nik Sumikawa        IEEE International Test Conference        2020年      共 10 页
    摘要 : In this work, we consider learning a wafer plot recognizer where only one training sample is available. We introduce an approach called Manifestation Learning to enable the learning. The underlying technology utilizes the Variatio... 展开

    [会议]   Yueling Jenny Zeng   Li-C. Wang   Chuanhe Jay Shan   Nik Sumikawa        International Test Conference        2020年      共 10 页
    摘要 : In this work, we consider learning a wafer plot recognizer where only one training sample is available. We introduce an approach called Manifestation Learning to enable the learning. The underlying technology utilizes the Variatio... 展开

    摘要 : Large-scale distributed systems offer computational power at unprecedented levels. In the past, HPC users typically had access to relatively few individual supercomputers and, in general, would assign a one-to-one mapping of appli... 展开

    摘要 : Large-scale distributed systems offer computational power at unprecedented levels. In the past, HPC users typically had access to relatively few individual supercomputers and, in general, would assign a one-to-one mapping of appli... 展开

    [会议]   Dylan Stow   Itir Akgun   Yuan Xie        ACM/IEEE International Workshop on System Level Interconnect Prediction        2019年      共 8 页
    摘要 : Interposer-based packaging is becoming a widespread methodology for tightly integrating multiple heterogeneous dies into a single package, with the potential to improve manufacturing yield and build larger-than-reticle-sized syste... 展开

    [会议]   Dylan Stow   Itir Akgun   Yuan Xie        ACM/IEEE International Workshop on System Level Interconnect Prediction        2019年      共 8 页
    摘要 : Interposer-based packaging is becoming a widespread methodology for tightly integrating multiple heterogeneous dies into a single package, with the potential to improve manufacturing yield and build larger-than-reticle-sized syste... 展开

    摘要 : Today, beamlines at DOE light sources produce vast amounts of data that can easily outgrow local compute and storage capacity. Beamline operators need to find mechanisms that facilitate easy access for experimenters to their data ... 展开

    摘要 : Today, beamlines at DOE light sources produce vast amounts of data that can easily outgrow local compute and storage capacity. Beamline operators need to find mechanisms that facilitate easy access for experimenters to their data ... 展开

    [会议]   Yueling Jenny Zeng   Min Jian Yang   Li-C. Wang        IEEE International Test Conference in Asia        2022年      共 6 页
    摘要 : We present a novel approach where wafer map pattern analytics are driven by natural language queries. At the core is a semantic parser that translates a user query into a meaning representation comprising instructions to generate ... 展开

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